The possibility of non-destructively recording the structure of any sample to identify its structure and detect the possibility of connection errors makes our system an important auxiliary tool in all production processes-not only in semiconductor technology. The application areas are diverse, from front-end to back-end.
| Wafers and bonded wafers | Flip chip |
| Silicon carbide ingots and wafers | Power Electronics |
| Silicon ingot | Binding interface |
| MEMS | CMOS image sensor |
| structure | Package components |
| Stabbed this | Passive components (resistance, capacitance) |
| microprocessor | Package |
| LED technology |