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Recording the structure of any sample

The possibility of non-destructively recording the structure of any sample to identify its structure and detect the possibility of connection errors makes our system an important auxiliary tool in all production processes-not only in semiconductor technology. The application areas are diverse, from front-end to back-end.

With our system, you can check the following:


Wafers and bonded wafers Flip chip
Silicon carbide ingots and wafers Power Electronics
Silicon ingot Binding interface
MEMS CMOS image sensor
structure Package components
Stabbed this Passive components (resistance, capacitance)
microprocessor Package
LED technology  


Chemical, physical and structural,
cleanliness analysis solution supplier
Nowadays we help users better understand a wide variety of materials, from polymers and mining to metals and from electronic chip to component.



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