The possibility of non-destructively recording the structure of any sample to identify its structure and detect the possibility of connection errors makes our system an important auxiliary tool in all production processes-not only in semiconductor technology. The application areas are diverse, from front-end to back-end.
Wafers and bonded wafers | Flip chip |
Silicon carbide ingots and wafers | Power Electronics |
Silicon ingot | Binding interface |
MEMS | CMOS image sensor |
structure | Package components |
Stabbed this | Passive components (resistance, capacitance) |
microprocessor | Package |
LED technology |